Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal managementThe announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.https://www.tomshardware.com/tech-industry/semiconductors/peking-university-builds-3d-chip-design-tool-tailored-to-huaweis-logicfolding-architecture#Tech #Technology #TechNews #AI #Gadgets #Software #Cybersecurity #Apple #Google #Microsoft #Startup #OpenSource #TomsHardware [Tom's Hardware]
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